Dual purpose press-bar and heat sink for high data transfer integrated circuit card reader

ABSTRACT

Various embodiments provide a dual purpose press-bar and heat sink for an integrated circuit card (ICC) reader. The dual purpose press-bar and heat sink provides two functions. First, the dual purpose press-bar and heat sink conducts and dissipates internal heat generated by a high data transfer ICC inserted in to the ICC reader. Second, the dual purpose press-bar and heat sink ensures that contact pads of the high data transfer ICC create reliable electrical connections with ICC contacts of the ICC reader. As such, the dual purpose press-bar and heat sink simultaneously dissipates heat from a high data transfer ICC and ensures that a high data transfer ICC maintains proper electrical connections with ICC contacts of an ICC reader.

BACKGROUND Technical Field

The present disclosure generally relates to a heat sink for a cardreader. In particular, the present disclosure is directed to a dualpurpose press-bar and heat sink for high data transfer card reader.

Description of the Related Art

As more integrated circuit cards (ICC), such as smart cards andsubscriber identification module (SIM) cards, are deployed into thepopulation, ICC readers have generally become ubiquitous in a variety ofelectronic devices, portable or not. In general, an ICC houses anembedded circuit capable of providing identification and authentication.Certain signals of the embedded circuit are brought to the surface ofthe ICC through a number of contact pads. When inserted into an ICCreader, these contact pads provide electrical connectivity between theembedded circuit within the ICC and a host in which the ICC readerresides. To effect the electrical connection between the ICC and thehost, a connector is employed in the ICC reader to serve as theinterface. The ICC reader requires a physical connection to the ICC thatis made by inserting the ICC into the ICC reader. Two known technologiesof insertion are (1) “sliding” contact technology and (2) “landing”contact technology. In general, sliding contact technology requires a“swipe” of the ICC to register the data on the ICC, providingconvenience, while landing contact technology requires the ICC to beinserted inside the reader before data can be registered.

Conventional ICCs conform to ISO/IEC standards. While ISO 7810standardizes the outer dimension of an ICC, or the card “envelope,” ISO7816 standardizes the location and signal connectivity of the card'scontact pads. ISO 7810 and ISO 7816 are standards well known in the artand will not be discussed in detail in this description.

ICCs and ICC readers with increased functionality are being designed.Consequently, these ICCs may use more power and, thus, ways to dissipateheat from the ICCs may be needed.

BRIEF SUMMARY

In accordance with the present disclosure, a dual purpose press-bar andheat sink for an integrated circuit card (ICC) reader is provided. Thedual purpose press-bar and heat sink provides two functions. First, thedual purpose press-bar and heat sink conducts and dissipates internalheat generated by a high data transfer ICC inserted in to the ICCreader. Second, the dual purpose press-bar and heat sink ensures thatcontact pads of the high data transfer ICC create reliable electricalconnections with ICC contacts of the ICC reader. As such, the dualpurpose press-bar and heat sink simultaneously dissipates heat from ahigh data transfer ICC and ensures that a high data transfer ICCmaintains proper electrical connections with ICC contacts of an ICCreader.

According to a first embodiment, an ICC reader includes a support membermounted to a circuit board and an encasing member. The support member isconfigured to support a high data transfer ICC when inserted in to theICC reader and secure ICC contacts to the circuit board. The encasingmember is physically coupled to the support member and includes a dualpurpose press-bar and heat sink. The dual purpose press-bar and heatsink has four sides and extends from the encasing member towards thesupport member. Particularly, the dual purpose press-bar and heat sinkis physically coupled to the encasing member on each of its four sidesand protrudes from the encasing member towards the support member. In apreferred embodiment, the dual purpose press-bar and heat sink ispositioned to overlie the ICC contacts and make physical contact withthe high data transfer ICC at a position corresponding to an embeddedcircuit housed within the high data transfer ICC.

According to a second embodiment, an ICC reader includes a supportmember mounted to a circuit board and an encasing member. The supportmember is configured to support a high data transfer ICC when insertedin to the ICC reader and secure ICC contacts to the circuit board. Theencasing member is mounted to the circuit board and overlies the supportmember. The encasing member includes a dual purpose press-bar and heatsink that is “L” shaped and extends from the encasing member towards thesupport member. Particularly, the dual purpose press-bar and heat sinkis physically coupled to the encasing member on one side and is curvedtowards the support member, creating an opening in the encasing member.In a preferred embodiment, the dual purpose press-bar and heat sink ispositioned to overlie the ICC contacts and make physical contact withthe high data transfer ICC at a position corresponding to an embeddedcircuit housed within the high data transfer ICC.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The foregoing and other features and advantages of the presentdisclosure will be more readily appreciated as the same become betterunderstood from the following detailed description when taken inconjunction with the accompanying drawings.

FIG. 1 illustrates an exemplary entertainment system that includes aclient device in which an embodiment of an ICC reader is implemented;

FIG. 2 is a block diagram of an exemplary client device in which oneembodiment of an ICC reader is implemented;

FIG. 3 illustrates a simplified exploded angled view of an ICC readerincluding a dual purpose press-bar and heat sink according to a firstembodiment;

FIG. 4 illustrates a simplified angled view of the ICC reader of FIG. 3,with some modifications, assembled and mounted to a circuit board;

FIG. 5 illustrates a simplified exploded angled view of an ICC readerincluding a dual purpose press-bar and heat sink according to a secondembodiment;

FIG. 6 illustrates a simplified angled view of the ICC reader of FIG. 5assembled and mounted to a circuit board; and

FIG. 7 illustrates a simplified cross-sectional view, of a dual purposepress-bar and heat sink and a high data transfer ICC according to oneembodiment.

DETAILED DESCRIPTION

In the following description, certain specific details are set forth inorder to provide a thorough understanding of various embodiments of thedisclosure. However, one skilled in the art will understand that thedisclosure may be practiced without these specific details. In someinstances, well-known structures associated with the manufacturing ofsemiconductor wafers have not been described in detail to avoidobscuring the descriptions of the embodiments of the present disclosure.

Unless the context requires otherwise, throughout the specification andclaims that follow, the word “comprise” and variations thereof, such as“comprises” and “comprising,” are to be construed in an open, inclusivesense, that is, as “including, but not limited to.”

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure or characteristicdescribed in connection with the embodiment is included in at least oneembodiment. Thus, the appearances of the phrases “in one embodiment” or“in an embodiment” in various places throughout this specification arenot necessarily all referring to the same embodiment. Furthermore, theparticular features, structures, or characteristics may be combined inany suitable manner in one or more embodiments.

In the drawings, identical reference numbers identify similar featuresor elements. The size and relative positions of features in the drawingsare not necessarily drawn to scale.

Referring to FIG. 1, an integrated circuit card (ICC) 14 typically has acontact area (not shown) comprising several gold-plated contact pads.These contact pads provide electrical connectivity when inserted into anICC reader 12, which is used as a communication medium between the ICC14 and a host 10. The host 10 provides power to the ICC 14 through theICC reader 12. On a conventional ICC 14, the contact area is defined bythe ISO/IEC standards. For example, for a smart card, ISO 7816 defines aone square centimeter contact area comprising eight contact pads, six ofthem are defined: VCC, GND, Reset, Clock, Vpp, Serial Data I/O, whiletwo are Reserved for Future Use, RFU1 and RFU2.

It is contemplated that a high data transfer ICC 14 with additional dataintensive functions, such as data encryption and decryption, will soonbe used in set-top boxes and as part of an improved conditional accesssecurity system. A high data transfer smart card will require more thanthe conventional eight contact pads. Particularly, a high data transfersmart card may have twelve defined contact pads (e.g., CLK, RST, VCC, SCIN−, SC IN+, I/O, VPP, VSS, CLK−, CLK+, SC OUT−, SC OUT+) on one surfaceof the smart card, with eight of the contact pads being in the samelocation as the eight contact pads in the conventional smart card setforth by the ISO 7816 standard, two contact pads being added to each ofthe four-contact-pad rows, and two new contact pads being added in a rowbetween the four-contact-pad rows. The ISO RFU1 and ISO RFU2 contactpads that are part of a conventional smart card may be omitted if notused. For example, see U.S. patent application Ser. No. 13/797,594,filed Mar. 12, 2013 and entitled “Enhanced smart card reader withmulti-level reading contacts.” With the additional functions and contactpads, high data transfer ICCs 14 may generate significant internal heat.One particular issue is that a processor on board a high data transferICC 14 may generate a large amount of heat that should be dissipated bymore than just the contact pads.

A dual purpose press-bar and heat sink for an ICC reader 12 is provided.In a preferred embodiment, the high data transfer ICC reader 12 isconfigured to read both high data transfer ICCs 14 and conventionalICCs.

FIG. 1 illustrates an entertainment system of a subscriber to abroadcast service with a conditional access system, according to oneembodiment. The entertainment system of FIG. 1 includes a client device10 coupled to a display device 18 over a first cable 16 and to acommunication network 20 over a second cable 8. The client device 10includes an ICC reader 12 configured to receive and read a high datatransfer ICC 14.

The client device 10 receives program content transmitted from at leasta content service provider (not shown) over the communication network20. The program content may be in the form of video, audio, data,multimedia, or another form appropriate for transmission over thecommunication network 20. The communication network 20 facilitates thetransmission of content from the content service provider to the clientdevice 10. The communication network 20 may include any type of wired orwireless communication system, such as satellite, antenna, cable, andservers, in their associated network topologies. In a preferredembodiment, the content service provider is a direct broadcast satelliteservice provider transmitting content over a satellite communicationnetwork that includes antennas and satellites, and the client device 10is a set top box.

The client device 10 is configured to receive program content from thecommunication network 20 and output the program content for display onthe display device 18. Because some program content is made availableonly to subscribers who pay a premium, some program content may beprotected to be accessible only to those subscribers. Such programcontent protection may be implemented by encrypting or scrambling theprogram content before it is transmitted to the client device 10. Theclient device 10, therefore, requires a decrypting or descrambling keyor data to output the protected contents to the display device 18. Inmany instances, the content service provider provides the premium payingsubscriber with the high data transfer ICC 14 containing the appropriatekey or data. With the high data transfer ICC 14 inserted in the ICCreader 12, the client device 10 can access and use the encryption key inthe high data transfer ICC 14 to decrypt or descramble the protectedprogram content. In a preferred embodiment, DVB-CSA and DVB-CI standardsfor content protection and conditional access is used. Other conditionalaccess systems are also contemplated.

FIG. 2 shows a block diagram of the client device 10. The client device10 includes tuner(s) 22, a main processor 26, an audio/video processor28, and the ICC reader 12. In one embodiment, the audio/video processor28 is on the same integrated chip as the main processor 26. The clientdevice 10 may include more functionalities and components than thoseillustrated in FIG. 2. In addition, each module may be implemented inhardware, software, firmware or a combination thereof.

The tuner(s) 22 is configured to receive an encrypted audio/video datastream. Particularly, as discussed with respect to FIG. 1, the tuner(s)receive program content from a content service provider through thecommunication network 20 and the cable 8.

The main processor 26 oversees data exchange between the client device10 and the high data transfer ICC 14. Particularly, the main processor26 is configured to extract encrypted audio/video program content fromthe received audio/video data stream based on an input from a user, andthen forward the selected encrypted audio/video program content to theICC reader 12.

The audio/video processor 28 provides descrambled audio/video content tothe display device 18 through cable 16.

The ICC reader 12 is configured to provide the selected encryptedaudio/video program content to the high data transfer ICC 14. The ICCreader 12 will be discussed in further detail with respect to FIGS. 3-6.

In prior systems, a client device also included a descrambler or decoderthat is configured to decode an audio/video signal from a tuner. For theclient device 10 of the inventive system, the descrambler or decoderresides on the high data transfer ICC 14 itself. As such, rather thansupply an encryption key or password to the main processor 26, theencryption key stays on the high data transfer ICC 14, and the high datatransfer ICC 14 decrypts or descrambles selected encrypted audio/videoprogram content. For example, in one embodiment, the descramble moduleon the high data transfer ICC 14 is a high data rate processor with fulldecode capability that can operate in real time. The high data transferICC 14 descrambles selected encrypted audio/video program content andre-scrambles it with a local key. The high data transfer ICC 14 thenprovides the re-scrambled audio/video program content to the ICC reader12 and the main processor 26. The main processor 26 then descrambles there-scram bled audio/video content with the local key and routes it tothe audio/video processor 28, which provides the descrambled audio/videocontent to the display device 18.

Prior ICCs generated little to no excess heat because audio/videoprogram content was processed on a client device instead of the ICC. Incontrast, for the client device 10, according to the inventive system,one of the main processing tasks of a conventional client device is nowcarried out on the high data transfer ICC 14. Consequently, the highdata transfer ICC 14 operates at a high data rate, processes a largeamount of data, and consumes a relatively large amount of power. This inturn causes the high data transfer ICC 14 to generate a significantamount of heat.

It is therefore beneficial to have a structure in an ICC reader that canremove heat from a high data transfer ICC and dissipate the heat to alarger, more open space. The ICC reader 12 as described herein providesa dual purpose press-bar and heat sink to remove excess heat from thehigh data transfer ICC 14.

FIG. 3 illustrates a simplified exploded angled view of an ICC reader 12a according to a first embodiment, and a simplified angled view of ahigh data transfer ICC 14 according to the first embodiment. The highdata transfer ICC 14 has a first side 31 that includes contact pads (notshown) electrically coupled to an embedded circuit housed within thehigh data transfer ICC 14, and a second side 33 opposite to the firstside. It should be noted that, although the high data transfer ICC 14 isshown as a smart card, the ICC reader 12 a may be adapted to be used forany type of ICC, including conventional ICCs. The ICC reader 12 aincludes a support member 30 and an encasing member 32.

The support member 30 includes guiding members 35 to guide an insertionof the high data transfer ICC 14. The support member 30 may be formedusing techniques now known or later developed. In a preferredembodiment, the support member 30 is made of non-conductive materialscommonly used for ICC readers. For example, plastic, such as ABS or hightemperature LCP, may be used.

The support member 30 is configured to support the high data transferICC 14 when inserted into the ICC reader 12 a and secure ICC contacts34. Each of the ICC contacts 34 are configured to create electricalconnections with the contact pads on the first side 31 of the high datatransfer ICC 14. For example, for a high data transfer smart card, theICC contacts may be configured to create electrical connections with theCLK, RST, VCC, SC IN−, SC IN+, I/O, VPP, VSS, CLK−, CLK+, SC OUT−, SCOUT+ contact pads. It should be noted that, although the ICC contacts 34are formed in adjacent rows, the ICC reader 12 a may include any numberof ICC contacts and have any configuration. As will be discussed infurther detail with respect to FIG. 4, the support member 30 and the ICCcontacts 34 are mounted to a circuit board.

The encasing member 32 includes a dual purpose press-bar and heat sink36, ribs 38, retention clips 40, an inspection hole 42, and engagingportions 44. In a preferred embodiment, the encasing member 32,including the dual purpose press-bar and heat sink 36, the ribs 38, andthe retention clips 40, and the engaging portions 44, is made from asingle piece of metal of high thermal conductibility, such as copper,aluminum, tungsten, silver, gold, titanium, platinum, steel, stainlesssteel, tantalum, or combinations thereof. A preferred material is acopper alloy. The encasing member 32 may be formed using techniques nowknown or later developed. For example, the encasing member 32 may beformed by stamping a flat sheet of metal using a forming press.Alternatively, the encasing member 32 may be cut by lasers or chemicallyetched.

The dual purpose press-bar and heat sink 36 has four sides and extendsfrom the encasing member 32 towards the support member 30. Particularly,the dual purpose press-bar and heat sink 36 is physically coupled to theencasing member 32 on each of its four sides and protrudes from theencasing member 32 towards the support member 30.

The dual purpose press-bar and heat sink 36 is configured to makephysical contact with the second side 33 of the high data transfer ICC14. In a preferred embodiment, the dual purpose press-bar and heat sink36 is positioned to overlie the ICC contacts 34 and make physicalcontact with the second side 33 of the high data transfer ICC 14 at aposition corresponding to the embedded circuit housed within the highdata transfer ICC 14. For example, see the simplified angled view of theICC reader 12 a assembled with the high data transfer ICC 14 inserted asillustrated in FIG. 4.

The dual purpose press-bar and heat sink 36 conducts and dissipatesinternal heat generated by the embedded circuit housed within the highdata transfer ICC 14. In a preferred embodiment, the surface area of thedual purpose press-bar and heat sink 36 is large to increase its contactwith the high data transfer ICC 14 and a surrounding cooling medium,such as air. The dual purpose press-bar and heat sink 36 will bediscussed in further detail with respect to FIG. 4.

The ribs 38 protrude from the encasing member 32 towards the supportmember 30. The ribs 38 are configured to make physical contact with thesecond side 33 of the high data transfer ICC 14. The ribs 38 ensure thatthe high data transfer ICC 14 remains coplanar when inserted in to theICC reader 12 a.

The retention clips 40 are configured to apply a physical force on thehigh data transfer ICC 14 when inserted in to the ICC reader 12 a. Theretention clips 40 ensure that the high data transfer ICC 14 remainsstationary when inserted.

The inspection holes 42 provide visual access to the inside of the ICCreader 12 a when assembled. For example, the inspection holes 42 providevisual access to and venting of heat for the ICC contacts 34 after theencasing member 32 is physically coupled to the support member 30.

The engaging portions 44 are configured to engage the support member 30to physically couple the encasing member 32 to the support member 30.For example, see the simplified angled view of the ICC reader 12 aassembled as illustrated in FIG. 4. The engaging portions 44 will bediscussed in further detail with respect to FIG. 4.

FIG. 4 illustrates a simplified angled view of the ICC reader 12 aaccording to the first embodiment, with some modifications, assembledand mounted to a circuit board 46 with the high data transfer ICC 14inserted.

The circuit board 46 includes an integrated circuit (not shown)configured to provide, for example, identification, authentication, datastorage, applications, data encryption, and data decryption. The circuitboard 46 also includes electrical components (not shown), such astransistors, inductors, resistors, and capacitors, for the tuner(s) 22,the processor 26, and the audio/video processor 28.

The support member 30 is mounted to the circuit board 46. As discussedwith respect to FIG. 3, the support member 30 is configured to supportthe high data transfer ICC 14 when inserted and secure the ICC contacts34. The support member 30 secures the ICC contacts 34 to the circuitboard 46 such that the ICC contacts 34 are electrically connected tocontact pads on the circuit board 46 and are electrically connected tothe contact pads on the first side 31 of the high data transfer ICC 14when the high data transfer ICC 14 is inserted.

The encasing member 32 is physically coupled to the support member 30 bythe engaging portions 44. Particularly, the engaging portions 44 areclipped on to the support member 30. When the encasing member 32 isphysically coupled to the support member 30 and the high data transferICC 14 is inserted, the dual purpose press-bar and heat sink 36, theribs 38, and the retention clips 40 physically contacts the second side33 of the high data transfer ICC 14 leaving a space 48 between theencasing member 32 and the second side 33 of the high data transfer ICC14. As such, the support member 30 and the encasing member 32 bothsupport the high data transfer ICC 14 when assembled. It should be notedthat, although the encasing member 32 is coupled to the support member30 by the engaging portions 44, any method may be used to physicallycouple the encasing member 32 to the support member 30.

As discussed with respect to FIG. 3, the encasing member 32 and the dualpurpose press-bar and heat sink 36 are both made of metal of highthermal conductibility, such as copper. By having both the encasingmember 32 and the dual purpose press-bar and heat sink 36 made of metaland directly connected to each other, the encasing member 32, itself,can accept and remove heat in addition to the dual purpose press-bar andheat sink 36. Particularly, the encasing member 32, itself, spreads heatover a larger surface area and increases the contact area with asurrounding cooling medium, such as air. As such, the encasing member 32assists the dual purpose press-bar and heat sink 36 for rapid transferof heat from the high data transfer ICC 14. In addition, the space 48allows a surround cooling medium to flow between the encasing member 32and the second side 33 of the high data transfer ICC 14. As such, asurrounding cooling medium may contact both the top and bottom surfacesof the upper portion of the encasing member 32, thereby furtherimproving heat dissipation. The dual purpose press-bar and heat sink 36provides two functions.

First, the dual purpose press-bar and heat sink 36 conducts anddissipates internal heat generated by the high data transfer ICC 14.Particularly, as discussed with respect to FIG. 3, the dual purposepress-bar and heat sink 36 physically contacts the second side 33 of thehigh data transfer ICC 14 at a position corresponding to the embeddedcircuit housed within the high data transfer ICC 14, and dissipates heatgenerated by the embedded circuit. Second, the dual purpose press-barand heat sink 36 ensures that the contact pads on the first side 31 ofthe high data transfer ICC 14 create reliable electrical connectionswith the ICC contacts 34. Particularly, in addition to the ribs 38 andthe retention clips 40, the dual purpose press-bar and heat sink 36ensures that the high data transfer ICC 14 remains coplanar wheninserted in to the ICC reader 12 a and ensures that the high datatransfer ICC 14 remains stationary when inserted. Therefore, in contrastto conventional encasing members that are typically made of plastic andact as a thermal insulator, the encasing member 32 includes the dualpurpose press-bar and heat sink 36 that simultaneously dissipates heatfrom the high data transfer ICC 14 and ensures that the high datatransfer ICC 14 maintains proper electrical connections with the ICCcontacts 34.

FIG. 5 illustrates a simplified exploded angled view of an ICC reader 12b according to a second embodiment, and a simplified angled view of ahigh data transfer ICC 14 according to the second embodiment. The highdata transfer ICC 14 has a first side 55 that includes contact padselectrically coupled to an embedded circuit housed within the high datatransfer ICC 14, and a second side 56 opposite to the first side. Itshould be noted that, although the high data transfer ICC 14 is shown asa type of SIM card, the ICC reader 12 b may be adapted to be used forany type of ICC, including conventional ICCs. The ICC reader 12 bincludes a support member 50 and an encasing member 52.

The support member 50 includes guiding members 58 to guide an insertionof the high data transfer ICC 14. The support member 50 may be formedusing techniques now known or later developed. In a preferredembodiment, the support member 50 is made of non-conductive materialscommonly used for ICC readers. For example, plastic, such as ABS or hightemperature LCP, may be used.

The support member 50 is configured to support the high data transferICC 14 when inserted in to the ICC reader and secure ICC contacts 60.Each of the ICC contacts 60 are configured to create electricalconnections with the contact pads on the first side 55 of the high datatransfer ICC 14. It should be noted that, although the ICC contacts 60are formed in adjacent rows, the ICC reader 12 b may include any numberof ICC contacts and have any configuration. As will be discussed infurther detail with respect to FIG. 6, the support member 50 and the ICCcontacts 60 are mounted to a circuit board.

The encasing member 52 includes a dual purpose press-bar and heat sink62 and mounting portions 54. In a preferred embodiment, the encasingmember 52, including the dual purpose press-bar and heat sink 62 and themounting portions 54, is made from a single piece of metal of highthermal conductibility, such as copper, aluminum, tungsten, silver,gold, titanium, platinum, steel, stainless steel, tantalum, orcombinations thereof. A preferred material is a copper alloy. Theencasing member 52 may be formed using techniques now known or laterdeveloped. For example, the encasing member 52 may be formed by stampinga flat sheet of metal using a forming press. Alternatively, the encasingmember 52 may be cut by lasers or chemically etched.

In contrast to the dual purpose press-bar and heat sink 36 of the ICCreader 12 a, the dual purpose press-bar and heat sink 62 is “L” shapedand extends from the encasing member 52 towards the support member 50.Particularly, the dual purpose press-bar and heat sink 62 is physicallycoupled to the encasing member 52 on one side and is curved towards thesupport member 50, creating an opening or aperture 64 in an upperportion of the encasing member 52. For example, see the simplifiedangled view of the ICC reader 12 b assembled with the high data transferICC 14 inserted as illustrated in FIG. 6.

The dual purpose press-bar and heat sink 62 is configured to makephysical contact with the second side 56 of the high data transfer ICC14. In a preferred embodiment, the dual purpose press-bar and heat sink62 is positioned to overlie the ICC contacts 60 and make physicalcontact with the second side 56 of the high data transfer ICC 14 at aposition corresponding to the embedded circuit housed within the highdata transfer ICC 14. For example, see the simplified angled view of theICC reader 12 b assembled with the high data transfer ICC 14 inserted asillustrated in FIG. 6.

The dual purpose press-bar and heat sink 62 conducts and dissipatesinternal heat generated by the embedded circuit housed within the highdata transfer ICC 14. In a preferred embodiment, the surface area of thedual purpose press-bar and heat sink 62 is large to increase its contactwith the high data transfer ICC 14 and a surrounding cooling medium,such as air. The dual purpose press-bar and heat sink 62 will bediscussed in further detail with respect to FIG. 6.

The mounting portions 54 are configured to engage a circuit board tomount the encasing member 52 to the circuit board. For example, see thesimplified angled view of the ICC reader 12 b assembled and mounted to acircuit board as illustrated in FIG. 6. The mounting portions 54 will bediscussed in further detail with respect to FIG. 6.

FIG. 6 illustrates a simplified angled view of the ICC reader 12 baccording to the second embodiment, assembled and mounted to a circuitboard 66, and the high data transfer ICC 14 inserted.

The circuit board 66 includes an integrated circuit (not shown)configured to provide, for example, identification, authentication, datastorage, applications, data encryption, and data decryption. The circuitboard 66 also includes electrical components (not shown), such astransistors, inductors, resistors, and capacitors, for the tuner(s) 22,the processor 26, and the audio/video processor 28.

The support member 50 is mounted to the circuit board 66. As discussedwith respect to FIG. 5, the support member 50 is configured to supportthe high data transfer ICC 14 when inserted and the secure ICC contacts60. The support member 50 secures the ICC contacts 60 to the circuitboard 66 such that the ICC contacts 60 are electrically connected tocontact pads on the circuit board 66 and are electrically connected tothe contact pads on the first side 55 of the high data transfer ICC 14when the high data transfer ICC 14 is inserted.

In contrast to the encasing member 32 of the ICC reader 12 a, theencasing member 52 is physically coupled to the circuit board 66, ratherthan the support member 50, by the mounting portions 54. Particularly,the mounting portions 54 are inserted in to slots of the circuit board66. When the encasing member 52 is physically coupled to the supportmember 50 and the high data transfer ICC 14 is inserted, the dualpurpose press-bar and heat sink 62 physically contacts the second side56 of the high data transfer ICC 14. It should be noted that, althoughthe encasing member 52 is coupled to the circuit board 66 by themounting portions 54, any method may be used to physically couple theencasing member 52 to the circuit board 66.

As discussed with respect to FIG. 5, the encasing member 52 and the dualpurpose press-bar and heat sink 62 are both made of metal of highthermal conductibility, such as copper. By having both the encasingmember 52 and the dual purpose press-bar and heat sink 62 made of metaland directly connected to each other, the encasing member 52, itself,can accept and remove heat in addition to the dual purpose press-bar andheat sink 62. Particularly, the encasing member 52, itself, spreads heatover a larger surface area and increases the contact area with asurrounding cooling medium, such as air. As such, the encasing member 52assists the dual purpose press-bar and heat sink 62 for rapid transferof heat from the high data transfer ICC 14. In addition, the opening 64allows a surround cooling medium to flow between the encasing member 52and the second side 56 of the high data transfer ICC 14. As such, asurrounding cooling medium may contact both inner and outer surfaces ofthe encasing member 32, thereby further improving heat dissipation.

Similar to the dual purpose press-bar and heat sink 36 of the firstembodiment, the dual purpose press-bar and heat sink 62 provides twofunctions. First, the dual purpose press-bar and heat sink 62 conductsand dissipates internal heat generated by the high data transfer ICC 14.Particularly, as discussed with respect to FIG. 5, the dual purposepress-bar and heat sink 62 physically contacts the second side 56 of thehigh data transfer ICC 14 at a position corresponding to the embeddedcircuit housed within the high data transfer ICC 14, and dissipates heatgenerated by the embedded circuit. Second, the dual purpose press-barand heat sink 62 ensures that the contact pads on the first side 55 ofthe high data transfer ICC 14 create reliable electrical connectionswith the ICC contacts 60. Particularly, the dual purpose press-bar andheat sink 62 ensures that the high data transfer ICC 14 remains coplanarwhen inserted in to the ICC reader 12 b and ensures that the high datatransfer ICC 14 remains stationary when inserted. Therefore, in contrastto conventional encasing members that are typically made of plastic andact as insulator, the encasing member 52 includes the dual purposepress-bar and heat sink 62 that simultaneously dissipates heat from thehigh data transfer ICC 14 and ensures that the high data transfer ICC 14maintains proper electrical connections with the ICC contacts 60.

FIG. 7 illustrates a simplified cross-sectional view, of the dualpurpose press-bar and heat sink 36 of the ICC reader 12 a, and a highdata transfer ICC 14, according to one embodiment, when it is insertedin to the ICC reader 12 a. The high data transfer ICC 14 includes anembedded circuit 68, contact pads 70, and a heat transfer plate 72.

The embedded circuit 68 is configured to perform processing for the highdata transfer ICC 14, such as decrypting or descrambling protectedprogram content as previously discussed.

The contact pads 70 are electrically coupled to the embedded circuit 68.The contact pads 70 provide data input/output to the ICC contacts 34.

The heat transfer plate 72 is physically coupled to the embedded circuit68. The heat transfer plate 72 improves thermal and heat transfer fromthe embedded circuit 68 to the dual purpose press-bar and heat sink 36by providing a metal-to-metal contact for the dual purpose press-bar andheat sink 36. In a preferred embodiment, the heat transfer plate 72 sitsphysically on top of the embedded circuit 68. For example, the heattransfer plate 72 may be coupled to the embedded circuit 68 by athermally conductive adhesive. In addition, in a preferred embodiment,the heat transfer plate 72 has a large surface area relative to thecontact pads 70 to increase thermal and heat transfer contact with thedual purpose press-bar and heat sink 36. It should be noted that theencasing member 32 and the dual purpose press-bar and heat sink 36 ofthe ICC reader 12 a are shown in FIG. 7 for illustrative purposes. Thehigh data transfer ICC 14 may also be used in conjunction with the ICCreader 12 b.

In this embodiment, the heat sink 36 is coupled to the high datatransfer ICC 14 itself rather than to the ICC contacts 34. Namely, inone embodiment, the heat transfer path is the chip 68 to the contacts 34and then to the heat sink 36, while in another embodiment, it is fromthe chip 68 to the heat transfer plate 72 then to the heat sink 36, andin another embodiment, it is from chip 68 to the heat sink 36, withadditional heat exiting the bottom via heat transfer plate 72, as shownin FIG. 7.

It will be appreciated that, although specific embodiments of thepresent disclosure are described herein for purposes of illustration,various modifications may be made without departing from the spirit andscope of the present disclosure. Accordingly, the present disclosure isnot limited except as by the appended claims.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

1. A card reader device, comprising: a support member including a firstsurface and a second surface opposite to the first surface; a pluralityof card contacts secured to the support member; and an encasing memberincluding: an elevated portion that at least partially covers the firstsurface of the support member; first and second sidewalls directlyattached to the elevated portion, the first sidewall being spaced fromthe second sidewall by the support member; first and second engagingportions that secures the encasing member to the support member, thefirst and second engaging portions being directly attached to the firstand second sidewalls, respectively, the first and second engagingportions in physical contact with the second surface of the supportmember; and a heat sink that projects from the elevated portion towardsthe first surface of the support member.
 2. The card reader device ofclaim 1 wherein the elevated portion, the first and second sidewalls,the first and second engaging portions, and the heat sink are a singlecontiguous piece.
 3. The card reader device of claim 2 wherein theencasing member is made of a conductive material and the support memberis made of a non-conductive material.
 4. The card reader device of claim1, further comprising a circuit board including a plurality of slots,the second surface of the support member facing the circuit board, theencasing member including mounting members directly attached to thefirst and second side sidewalls, the mounting members securing theencasing member to the circuit board, the mounting members extendingfrom the first and second sidewalls into the plurality of slots.
 5. Thecard reader device of claim 1 wherein the encasing member includes firstand second retention clips in the elevated portion, the heat sink beingpositioned between the first and second retention clips.
 6. The cardreader device of claim 1 wherein the encasing member includes aplurality of apertures in the elevated portion, the plurality ofapertures exposing the first surface of the support member.
 7. A cardreader device, comprising: a circuit board including a plurality ofslots; a support member having a first side and a second side oppositeto the first side; a plurality of card contacts electrically coupled tothe circuit board, the plurality of card contacts being held in positionby the support member; and an encasing member including: an elevatedportion positioned on the first side of the support member; a heat sinkin the elevated portion, the heat sink directly overlying the pluralityof card contacts; engaging portions that secures the encasing member tothe support member, the engaging portions being positioned on the secondside of the support member, the support member being sandwiched betweenthe elevated portion and the engaging portions; sidewalls directlyattached to the elevated portion and the engaging portions, the elevatedportion being spaced from the engaging portions by the sidewalls; andmounting members that secures the encasing member to the circuit board,the mounting members being directly attached to the sidewalls, themounting members extending from the sidewalls into the plurality ofslots of the circuit board.
 8. The card reader device of claim 7 whereinthe elevated portion, the heat sink, the engaging portions, thesidewalls, and the mounting members are a single contiguous piece. 9.The card reader device of claim 8 wherein the support member is a singlecontiguous piece.
 10. The card reader device of claim 9 wherein theencasing member is made of a conductive material and the support memberis made of a non-conductive material.
 11. The card reader device ofclaim 12, wherein the encasing member includes retention clips in theelevated portion.
 12. The card reader device of claim 12, wherein theencasing member includes a plurality of holes in the elevated portionthat surround the heat sink.
 13. A card reader device, comprising: asupport member; a plurality of card contacts secured to the supportmember; and an encasing member including: an elevated portion overlyingand spaced from the support member; a heat sink in the elevated portion,the heat sink including: a first portion directly attached to theelevated portion, the first portion extends from the elevated portiontowards the support member; and a second portion that is attached to theelevated portion by the first portion, the second portion being detachedand separated from the elevated portion to provide an air flow channelthat flows through the aperture and between the elevated portion and thesupport member, the second portion directly overlying the plurality ofcard contacts; and an aperture in the elevated portion, the aperturedirectly overlying the second portion of the heat sink and the pluralityof card contacts.
 14. The card reader device of claim 13 wherein theelevated portion and the heat sink are a single contiguous piece. 15.The card reader device of claim 13 wherein the first portion extends ina first direction and the second portion extends in a second directionthat is substantially perpendicular to the first direction.
 16. The cardreader device of claim 13, further comprising a circuit board includinga plurality of slots, the encasing member including sidewalls andmounting members directly attached to the sidewalls, the mountingmembers securing the encasing member to the circuit board, the mountingmembers extending from the sidewalls into the plurality of slots. 17.The card reader device of claim 13, wherein the support member includesa base, sidewalls, and holding portions, the base, sidewalls, and theholding portions forming a slot configured to receive a card.